Taiwan Semiconductor Manufacturing Company (TSMC) is the world's leading dedicated independent semiconductor foundry, founded in 1987 by Morris Chang. The timeline traces its corporate journey from founding to present, highlighting technological breakthroughs, executive leadership, global expansions, and financial milestones.
Chronological Storyline (40 Milestones)
Feb 21, 1987 CE
TSMC Founded
Morris Chang founds Taiwan Semiconductor Manufacturing Company (TSMC) in Hsinchu, Taiwan, as the world's first dedicated semiconductor foundry. #semiconductor #foundry #Taiwan
TSMC Founded By 曾 成訓 - https://www.flickr.com/photos/tsengphotos/53114942112/, CC BY 2.0, https://commons.wikimedia.org/w/index.php?curid=147718717
1987 CE
Fab 1 Construction Begins
TSMC begins construction of its first fabrication plant, Fab 1, in Hsinchu Science Park, marking the start of its manufacturing capabilities. #semiconductor #manufacturing
1989 CE
First Revenue Generated
TSMC records its first revenue from foundry services, establishing its business model of manufacturing chips for fabless companies. #semiconductor #business
1993 CE
First Profitable Year
TSMC achieves its first profitable year, demonstrating the viability of the pure-play foundry model. #semiconductor #finance
Sep 5, 1994 CE
IPO on Taiwan Stock Exchange
TSMC lists on the Taiwan Stock Exchange (TWSE) under ticker 2330, raising capital for expansion. #IPO #stockmarket
1995 CE
TSMC North America Established
TSMC establishes its North American subsidiary in San Jose, California, to better serve U.S. clients like AMD and NVIDIA. #semiconductor #global
1996 CE
Introduction of 0.35µm Process
TSMC introduces its 0.35-micron (350nm) CMOS process technology, a key step in advancing chip miniaturization. #technology #semiconductor
1997 CE
Introduction of 0.25µm Process
TSMC rolls out 0.25-micron (250nm) process technology, enabling faster and more power-efficient chips. #semiconductor #innovation
1999 CE
Introduction of 0.18µm Process
TSMC introduces 0.18-micron (180nm) process, becoming one of the first foundries to offer this advanced node. #semiconductor #tech
2000 CE
Acquisition of Worldwide Semiconductor Manufacturing Corp
TSMC acquires Worldwide Semiconductor Manufacturing Corp (WSMC), a foundry spun off from Acer, to expand capacity. #merger #acquisition
2001 CE
First Foundry to Offer 0.13µm Copper Process
TSMC becomes the first foundry to mass-produce chips using 0.13-micron (130nm) copper interconnect process, boosting performance. #semiconductor #copper
2002 CE
Fab 12 (12-inch) Construction Begins
TSMC starts building its first 12-inch (300mm) wafer fab, Fab 12, in Hsinchu, to handle larger wafers and reduce costs. #semiconductor #manufacturing
2003 CE
Introduction of 90nm Process
TSMC introduces 90nm process technology, enabling higher transistor density and lower power consumption. #technology #semiconductor
2004 CE
Introduction of 65nm Process
TSMC rolls out 65nm process technology, used in GPUs and mobile processors. #semiconductor #innovation
May 11, 2005 CE
Morris Chang Retires as CEO, Rick Tsai Appointed
Founder Morris Chang steps down as CEO, with Rick Tsai taking over day-to-day operations. Chang remains chairman. #leadership #CEO
2006 CE
Introduction of 45nm Process
TSMC introduces 45nm process technology, a key node for high-performance computing and graphics. #semiconductor #tech
2007 CE
Introduction of 32nm Process
TSMC launches 32nm process technology, enabling further miniaturization and energy efficiency. #semiconductor #innovation
2008 CE
Introduction of 40nm Process
TSMC introduces 40nm process technology, addressing the demand for low-power mobile chips. #semiconductor #mobile
Jun 11, 2009 CE
Morris Chang Returns as CEO
Amid the global financial crisis, Morris Chang reassumes the CEO role to steer TSMC through challenging times. #leadership #crisis
2010 CE
Introduction of 28nm Process
TSMC introduces 28nm process technology, a highly successful node used in many SoCs and GPUs. #semiconductor #tech
2011 CE
Annual Revenue Surpasses $10 Billion
TSMC's annual revenue exceeds $10 billion for the first time, solidifying its position as the world's largest dedicated foundry. #semiconductor #finance
2012 CE
Introduction of 20nm Process
TSMC introduces 20nm process technology, a precursor to FinFET nodes. #semiconductor #innovation
2013 CE
Introduction of 16nm FinFET Process
TSMC launches its first FinFET process, 16nm, delivering significant performance and power improvements over planar transistors. #semiconductor #FinFET
2014 CE
Introduction of 10nm Process
TSMC introduces 10nm process technology, used in high-end mobile processors like Apple's A10X. #semiconductor #tech
Jun 1, 2015 CE
Mark Liu and C.C. Wei Become Co-CEOs
Morris Chang retires again, with Mark Liu and C.C. Wei appointed as co-CEOs, marking a new leadership structure. #leadership #CEO
2016 CE
Introduction of 7nm Process
TSMC announces its 7nm process technology, which later becomes a major node for Apple, AMD, and NVIDIA chips. #semiconductor #innovation
2017 CE
Mass Production of 7nm Chips
TSMC becomes the first foundry to mass-produce 7nm chips, starting with Apple's A12 Bionic processor. #semiconductor #manufacturing
2018 CE
Development of 5nm Process
TSMC begins development of 5nm process technology, targeting extreme ultraviolet (EUV) lithography. #semiconductor #EUV
Jun 1, 2019 CE
Announcement of 3nm Process Development
TSMC announces plans to develop 3nm process technology, expected to enter production by 2022. #semiconductor #future
May 15, 2020 CE
Announcement of Arizona Fab
TSMC announces plans to build a $12 billion 5nm fab in Arizona, USA, marking its first advanced node facility in the United States. #global #expansion
Jul 1, 2020 CE
Becomes Most Valuable Company in Asia
TSMC's market capitalization surpasses $410 billion, making it the most valuable company in Asia. #finance #TSMC
2020 CE
5nm Process Enters Mass Production
TSMC starts volume production of 5nm chips, including Apple's A14 and M1 processors. #semiconductor #manufacturing
Mar 1, 2021 CE
Announcement of Japan Fab
TSMC announces a joint venture with Sony to build a specialty fab in Japan, expanding its global footprint. #global #expansion
Apr 1, 2021 CE
Announced $100 Billion Investment Over Three Years
TSMC reveals plans to invest $100 billion over the next three years to increase capacity and R&D. #investment #growth
Aug 1, 2022 CE
Announcement of 2nm Process Technology
TSMC announces its 2nm process technology, scheduled for mass production in 2025, using nanosheet transistors. #semiconductor #innovation
Nov 14, 2022 CE
Market Cap Surpasses $500 Billion
TSMC's market capitalization surpasses $500 billion for the first time, reflecting strong demand for its leading-edge chips. #finance #TSMC
Dec 6, 2022 CE
Arizona Fab Groundbreaking Ceremony
TSMC holds a tool-in ceremony for its Arizona fab, attended by U.S. President Joe Biden, emphasizing its strategic importance. #global #semiconductor
Aug 8, 2023 CE
Announcement of European Fab in Germany
TSMC announces a joint venture to build a fab in Dresden, Germany, targeting automotive and industrial chips. #global #expansion
2023 CE
3nm Process Enters Mass Production
TSMC begins volume production of 3nm chips, including Apple's M3 and A17 Pro processors. #semiconductor #manufacturing
Apr 24, 2024 CE
2nm Process Technology Announced
TSMC officially unveils its 2nm process technology, promising significant performance and efficiency gains. #semiconductor #innovation