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Taiwan Semiconductor Manufacturing Company (TSMC)

Companies/Taiwan  •  Curated by Admin Timeline.sg

Taiwan Semiconductor Manufacturing Company (TSMC) is the world's leading dedicated independent semiconductor foundry, founded in 1987 by Morris Chang. The timeline traces its corporate journey from founding to present, highlighting technological breakthroughs, executive leadership, global expansions, and financial milestones.

Chronological Storyline (40 Milestones)

Feb 21, 1987 CE

TSMC Founded

Morris Chang founds Taiwan Semiconductor Manufacturing Company (TSMC) in Hsinchu, Taiwan, as the world's first dedicated semiconductor foundry. #semiconductor #foundry #Taiwan

TSMC Founded
TSMC Founded
By 曾 成訓 - https://www.flickr.com/photos/tsengphotos/53114942112/, CC BY 2.0, https://commons.wikimedia.org/w/index.php?curid=147718717
1987 CE

Fab 1 Construction Begins

TSMC begins construction of its first fabrication plant, Fab 1, in Hsinchu Science Park, marking the start of its manufacturing capabilities. #semiconductor #manufacturing

1989 CE

First Revenue Generated

TSMC records its first revenue from foundry services, establishing its business model of manufacturing chips for fabless companies. #semiconductor #business

1993 CE

First Profitable Year

TSMC achieves its first profitable year, demonstrating the viability of the pure-play foundry model. #semiconductor #finance

Sep 5, 1994 CE

IPO on Taiwan Stock Exchange

TSMC lists on the Taiwan Stock Exchange (TWSE) under ticker 2330, raising capital for expansion. #IPO #stockmarket

1995 CE

TSMC North America Established

TSMC establishes its North American subsidiary in San Jose, California, to better serve U.S. clients like AMD and NVIDIA. #semiconductor #global

1996 CE

Introduction of 0.35µm Process

TSMC introduces its 0.35-micron (350nm) CMOS process technology, a key step in advancing chip miniaturization. #technology #semiconductor

1997 CE

Introduction of 0.25µm Process

TSMC rolls out 0.25-micron (250nm) process technology, enabling faster and more power-efficient chips. #semiconductor #innovation

1999 CE

Introduction of 0.18µm Process

TSMC introduces 0.18-micron (180nm) process, becoming one of the first foundries to offer this advanced node. #semiconductor #tech

2000 CE

Acquisition of Worldwide Semiconductor Manufacturing Corp

TSMC acquires Worldwide Semiconductor Manufacturing Corp (WSMC), a foundry spun off from Acer, to expand capacity. #merger #acquisition

2001 CE

First Foundry to Offer 0.13µm Copper Process

TSMC becomes the first foundry to mass-produce chips using 0.13-micron (130nm) copper interconnect process, boosting performance. #semiconductor #copper

2002 CE

Fab 12 (12-inch) Construction Begins

TSMC starts building its first 12-inch (300mm) wafer fab, Fab 12, in Hsinchu, to handle larger wafers and reduce costs. #semiconductor #manufacturing

2003 CE

Introduction of 90nm Process

TSMC introduces 90nm process technology, enabling higher transistor density and lower power consumption. #technology #semiconductor

2004 CE

Introduction of 65nm Process

TSMC rolls out 65nm process technology, used in GPUs and mobile processors. #semiconductor #innovation

May 11, 2005 CE

Morris Chang Retires as CEO, Rick Tsai Appointed

Founder Morris Chang steps down as CEO, with Rick Tsai taking over day-to-day operations. Chang remains chairman. #leadership #CEO

2006 CE

Introduction of 45nm Process

TSMC introduces 45nm process technology, a key node for high-performance computing and graphics. #semiconductor #tech

2007 CE

Introduction of 32nm Process

TSMC launches 32nm process technology, enabling further miniaturization and energy efficiency. #semiconductor #innovation

2008 CE

Introduction of 40nm Process

TSMC introduces 40nm process technology, addressing the demand for low-power mobile chips. #semiconductor #mobile

Jun 11, 2009 CE

Morris Chang Returns as CEO

Amid the global financial crisis, Morris Chang reassumes the CEO role to steer TSMC through challenging times. #leadership #crisis

2010 CE

Introduction of 28nm Process

TSMC introduces 28nm process technology, a highly successful node used in many SoCs and GPUs. #semiconductor #tech

2011 CE

Annual Revenue Surpasses $10 Billion

TSMC's annual revenue exceeds $10 billion for the first time, solidifying its position as the world's largest dedicated foundry. #semiconductor #finance

2012 CE

Introduction of 20nm Process

TSMC introduces 20nm process technology, a precursor to FinFET nodes. #semiconductor #innovation

2013 CE

Introduction of 16nm FinFET Process

TSMC launches its first FinFET process, 16nm, delivering significant performance and power improvements over planar transistors. #semiconductor #FinFET

2014 CE

Introduction of 10nm Process

TSMC introduces 10nm process technology, used in high-end mobile processors like Apple's A10X. #semiconductor #tech

Jun 1, 2015 CE

Mark Liu and C.C. Wei Become Co-CEOs

Morris Chang retires again, with Mark Liu and C.C. Wei appointed as co-CEOs, marking a new leadership structure. #leadership #CEO

2016 CE

Introduction of 7nm Process

TSMC announces its 7nm process technology, which later becomes a major node for Apple, AMD, and NVIDIA chips. #semiconductor #innovation

2017 CE

Mass Production of 7nm Chips

TSMC becomes the first foundry to mass-produce 7nm chips, starting with Apple's A12 Bionic processor. #semiconductor #manufacturing

2018 CE

Development of 5nm Process

TSMC begins development of 5nm process technology, targeting extreme ultraviolet (EUV) lithography. #semiconductor #EUV

Jun 1, 2019 CE

Announcement of 3nm Process Development

TSMC announces plans to develop 3nm process technology, expected to enter production by 2022. #semiconductor #future

May 15, 2020 CE

Announcement of Arizona Fab

TSMC announces plans to build a $12 billion 5nm fab in Arizona, USA, marking its first advanced node facility in the United States. #global #expansion

Jul 1, 2020 CE

Becomes Most Valuable Company in Asia

TSMC's market capitalization surpasses $410 billion, making it the most valuable company in Asia. #finance #TSMC

2020 CE

5nm Process Enters Mass Production

TSMC starts volume production of 5nm chips, including Apple's A14 and M1 processors. #semiconductor #manufacturing

Mar 1, 2021 CE

Announcement of Japan Fab

TSMC announces a joint venture with Sony to build a specialty fab in Japan, expanding its global footprint. #global #expansion

Apr 1, 2021 CE

Announced $100 Billion Investment Over Three Years

TSMC reveals plans to invest $100 billion over the next three years to increase capacity and R&D. #investment #growth

Aug 1, 2022 CE

Announcement of 2nm Process Technology

TSMC announces its 2nm process technology, scheduled for mass production in 2025, using nanosheet transistors. #semiconductor #innovation

Nov 14, 2022 CE

Market Cap Surpasses $500 Billion

TSMC's market capitalization surpasses $500 billion for the first time, reflecting strong demand for its leading-edge chips. #finance #TSMC

Dec 6, 2022 CE

Arizona Fab Groundbreaking Ceremony

TSMC holds a tool-in ceremony for its Arizona fab, attended by U.S. President Joe Biden, emphasizing its strategic importance. #global #semiconductor

Aug 8, 2023 CE

Announcement of European Fab in Germany

TSMC announces a joint venture to build a fab in Dresden, Germany, targeting automotive and industrial chips. #global #expansion

2023 CE

3nm Process Enters Mass Production

TSMC begins volume production of 3nm chips, including Apple's M3 and A17 Pro processors. #semiconductor #manufacturing

Apr 24, 2024 CE

2nm Process Technology Announced

TSMC officially unveils its 2nm process technology, promising significant performance and efficiency gains. #semiconductor #innovation